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BP10 is a solvent-free epoxy-based bonding paste which was especially developed for fast setting bondings in composites applications and for bondings of composites and metal. BP10 has a good degree of cure even at lower ambient temperatures. The cartridges allow for clean, selective application. To achieve full mechanical properties and thermal resistance, post-curing of at least 3h 60°C is recommended. However, good mechanical properties are already developed after initial curing of 24h at room temperature.